For more information

Administrative Contact:
Mary Nguyen
Nanofabrication Facility
3605 Cullen Blvd, Rm 1009
Houston, TX 77204-5062
Phone: 713-743-4101
Email: dknguyen [at] uh [dot] edu

Technical Contact:
Long Chang
Nanofabrication Facility
3605 Cullen Blvd, Rm 1007A
Houston, TX 77204-5062
Phone: 713-743-5235
Email: lvchang [at] central [dot] uh [dot] edu

Campus Map
Google Map

Printer-friendly version

Equipment

The facility and all its equipment is available to the entire University of Houston community as well as to the outside users on a pay-per-use basis. Refer to the Nanofab Userfees table for further information.

Equipment grouped into categories by primary use, some have multiple uses.

Pattern Making

Spin Coater Brewer Cee 200 Spin Coater Used to place an even layer of photoresist polymer on wafers
Mask Aligner ABM Mask Aligner Transfers a pattern from a mask to UV sensitive photoresist using UV light
SEM (eBeam) FEI XL-30FEG SEM equipped with NPGS (nanopattern generation system) A scanning electron microscope upgraded with capability of making nanoscale patterns in photoresist
eBeam Writer JEOL JBX 5500FS eBeam writer A specialized tool for producing custom patterns across an up to 4" wafer with sub-10 nm resolution.
Nanonex NX-2004 Nanoimprinter Nanoimprinter The Nanoimprinter is used to replicate a patterned mold with sub-10 nm resolution in several minutes.

Material Deposition

UHV Sputtering System AJA UHV six-source sputtering system Deposits thin films down to sub-nanometer thickness uniformly across wafers
eBeam Evaporator Thermionics eBeam Evaporator Creates a vapor from small metal pellets which condenses on the substrate to create films; can be more cost effective than the UHV Sputtering System when using expensive metals.
Desktop Sputtering System Denton Desk II A simple desktop sputtering system for coating samples.

Etching

Reactive Ion Etcher (RIE 80) Oxford Plasma Lab 80 Plus RIE (Ar, O2, CF4, CHF3, SF6) Uses a plasma to etch out a pattern in a wafer, the surface of the wafer covered by photoresist is protected and the exposed areas are etched.
Reactive Ion Etcher (RIE 100) Oxford Plasma Lab 100 RIE (Ar, O2) Uses a plasma to etch out a pattern in a wafer, the surface of the wafer covered by photoresist is protected and the exposed areas are etched.
Deep Reactive Ion Etcher (RIE 180) Oxford Plasma Lab ICP 180 RIE (Ar, O2, CHF3, SF6, C4F8) A more advanced form of the reactive ion etcher allowing very deep and narrow trenches to be etched
Ion Mill Custom High-Rate Ion Mill Uses argon atoms to ‘sand blast’ metals which are not etched well by the reactive ion etchers.

Analysis

Atomic Force Microscope Veeco Dimensions 3000 Atomic Force Microscope Create topographic images with nanometer scale resolution of a sample by rastering a sharp probe across the sample surface.
Profilometer Alpha-Step 200 Profilometer Drags a sharp probe across a sample surface to create a height profile
Ellipsometer Gaertner Ellipsometer Used to measure the thickness of one or more thin films
Optical Microscopes Leitz Microscope, Olympus Inspection Microscope For visual inspection

Processing

RTP AccuThermo AW 410 RTP/RTA Creates oxide layers on wafer
Ovens Blue M Electric Ovens For oxidation or other processing needs.
Wet Benches Exhausted Wet Benches Benches under fume hoods that contain work surfaces, sinks, vacuum lines, nitrogen jets, water sprayers, etc.
Nanofab Inventory Nanofab Inventory Facility users can enter items into the database to establish ownership.

Direct Machining

Focused Ion Beam (FIB) FEI 235 Dual-Beam Focused Ion-beam System equipped with TEM sample extraction probe An electron microscope and a gallium ion beam capable of milling nanoscale patterns into a sample