For more information

Administrative Contact:
Mary Nguyen
Nanofabrication Facility
3605 Cullen Blvd, Rm 1009
Houston, TX 77204-5062
Phone: 713-743-4104
Email: dknguyen [at] uh [dot] edu

Technical Contact:
Long Chang
Nanofabrication Facility
3605 Cullen Blvd, Rm 1007A
Houston, TX 77204-5062
Phone: 713-743-5235
Email: lvchang [at] central [dot] uh [dot] edu

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Equipment—Material Deposition

UHV Sputtering System
AJA UHV six-source sputtering system
AJA
Custom
Sputtering System
This system uses a magnetron sputtering source to create a plasma. Argon atoms in the plasma become ionized and are driven by the eclectic field to collide with a ‘target’ made of a high purity material such as copper. The collision causes copper atoms to be blasted away from the target and toward the sample substrate where they are deposited. Sub-nanometer layers can be deposited with 2% uniformity across a 3” wafer. This system has six sputtering sources in the main chamber and one additional source in the load lock.
eBeam Evaporator
Thermionics eBeam Evaporator
Thermionics
Electron Beam Evaporator
This device targets a tiny crucible containing a high purity material such as gold with a focused electron beam. The beam can heat the material as high at 3500C, causing the material to sublimate. The rapidly cooling vapor condenses on the sample substrate and, like the sputtering system, thin layers can be created with a high degree of control over thickness.
Desktop Sputtering System
Denton Desk II
Denton Vacuum LLC
DESK-II
Sputtering System
This small desktop system can coat samples via DC sputtering. It also has the capability to pre-clean samples by etching them. The Denton Desk II is primarily intended for coating SEM samples to make them conductive. It cannot provide the purity or uniformity of a UHV sputtering system but it is quick and easy to use.